HT-010 - Sn10Pb88Ag2 high-temperature solder wire NC-core ROL0 - 100g spool
HT-010 - Sn10Pb88Ag2 high-temperature solder wire NC-core ROL0 - 100g spool
STIRRI®HT-010™ - high-temperature Sn10Pb88Ag2 solder wire NC-core ROL0 - 100g spool
High-Temperature Performance: Specifically designed for semiconductors and multi-step assembly processes, ensuring reliable soldering in demanding environments.
Alloy Composition: Features a robust blend of 10% Tin (Sn), 88% Lead (Pb), and 2% Silver (Ag), providing enhanced durability and mechanical strength for superior solder joints.
Optimal Melting Point: Melting point of 290ºC and solidification temperature of 268ºC, making it ideal for controlled soldering environments and thermal cycling applications. (*LIQ and SOL temperature range as per IPC J-STD-006B)
No-Clean Flux Core: Contains 2.5%-3.3% rosin-based no-clean flux core for excellent wetting, minimal residue, and ease of use, ensuring clean and efficient soldering.
Certified Compliance: Meets IPC J-STD-006B standards for quality and performance, making it a trusted choice for high-temperature and semiconductor applications, packaged in a convenient spool size for practical use.
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Modern Surface Mounting Technology for the era of unmanned vehicles and space travels
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