ASM-010 - Sn10Pb88Ag2 high-temp no-clean low-voiding rosin solder paste 2% silver (ROL0)

    Prolonged high-temperature reflow profiles

      • Class

        NC/ROL0

        J-STD-005C

      • Stencil

        ~ 12 hours

        at 30-70% R/H @20-25ºC

      • Tack

        44-48

        Tack force g/cm

      • Print

        200-285

        Viscosity in Malcom mPA/s x10³ 10RPM @25ºC

      • Dispense

        90-160

        Viscosity in Malcom mPA/s x10³ 10RPM @25ºC
      1 4

      STIRRI®

      SP-SSM-020-010-3

      Mesh Type
      Size
      $16.32 USD
      $39.99 USD $16.32 USD
      Sale Sold out

      In stock

      STIRRI-ASM-010 is a high-temperature solder paste made using Sn10Pb88Ag2 alloy and popular ASM solder flux.

      Suitability

      Semiconductors. Hot Air rework.

      Solder Paste Viscosity

      Values in Malcom @ 10 RPM/25ºC x10³ mPa/s
      Printing: 200-285
      Dispensing: 90-160

      Stencil Life

      Printer Operation

      Print Speed: 25-100 mm/sec

      Squeegee Pressure: 70-250g/cm of blade

      Under Stencil Wipe: Once every 10-25 prints, or as necessary

      Some adjustments may be necessary depending on process requirements

      Stencil Cleaning

      No-clean solder paste that can be left on the board for many SMT assemblies. For applications requiring cleaning, the paste can be cleaned using commercial residue removers.

      Automated cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA), co-solvents and/or ultrasonic scrubbers, vapor degreaser.

      Do you make this paste untraceable - without QCA?

      UV light is for optional for QC certification only - not required for operating the paste.

      However, this material is also available untraceable - without QC-Aid™, meaning no specific optical UV-tracer has been deployed. Contact us for the MPN (Manufacturing Part Number) without UV-tracer.

      Storage and Handling

      To obtain the maximum shelf life STIRRI Soldering Paste & Liquid Solder™ should be stored in a refrigerator between 3-8°C (37-46°F). Unopened solder paste stored at room temperature, 25°C (77°F). Syringes and cartridges should be stored in the refrigerator vertically, dispensing tip pointing down.

      Allow 4-8 hours for solder paste to reach optimal operating temperature of 20-25°C (68-77°F). To avoid condensation inside solder paste - keep solder paste container sealed while warming the solder paste to operating temperature, otherwise moisture may end up inside the container and contaminate solder paste!

      NEVER FREEZE SOLDER PASTE!

      Safety Notice

      This product is designed for professional consumers. Information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having technical skill, at their own risk. Consumers should make their own tests to determine the suitability of each product for their particular process. Manufacturer or distributors will assume no liability for results obtained or damages incurred through the application of the data presented - try on a small non-critical surface first!

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      RFQ - Request for Quotation

      You are in good hands!

      Made in the USA to the applicable industry standards 100% customer satisfaction guaranteed!

      Liquid-proof the assembly with Nano-Coating - dries in less than 8 seconds

      STIRRI HydraCoat™ is a liquid repellent making PCB liquid proof, instantly improving assembly value!

      With an impressive droplet contact angle of over 113º, this nonconducting solution creates an invisible hydrophobic shield repelling weather, humidity, moisture - coated PCB continues to function even when fully submerged!

      Broadly suited for consumer devices, automotive circuits, urban and landscaping lightning, LED, medical or electronic devices, marine, boating and yachting industries.

      Dry to touch in less than 8 seconds, self cures in 24 hrs or 10 min in 60ºC chamber.

      STIRRI's Conformal nano-coating ensures end-customer satisfaction while virtually eliminating assembly claims due to environmental or consumer liquid damages.

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