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BGA Solder Spheres Sn96.5.Ag3.Cu0.5 - LF solder balls 99.9% sphericity

BGA Solder Spheres Sn96.5.Ag3.Cu0.5 - LF solder balls 99.9% sphericity

Precio habitual $126.99 USD
Precio habitual Precio de oferta $126.99 USD
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BGA Packaging

BGA Solder Spheres Sn96.5/Ag3/Cu0.5 (SAC305)

– Made from virgin materials – 99.95% pure
– Oxide-free, conflict-free
– Perfectly round – over 95% spheres have 99.95% sphericity
– Complies with IPC-JSTD-006 requirements

Manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages.

Exceed both the IPC and MIL standards for purity levels and size tolerances.

Nominal sizes from 3 mil to 45 mil, and custom solder sphere sizes are also available upon request.

Many alloys are available for use in solder spheres, including several lead-free alternatives.

Available packaging - 25K & 250K bottles, 500k & 1M jars

Size Distribution

99% of the spheres are within the size range: +/- 0.0005"
99.95% of the spheres are within the size range: +/- 0.001"

Sphericity

99.95% of the spheres exceed 95% roundness factor.

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Tecnología moderna de montaje en superficie para la era de los vehículos no tripulados y los viajes espaciales

Fabricado en los EE. UU. según los estándares industriales aplicables. ¡100% de satisfacción del cliente garantizada!