STIRRI® UNAPOXY-UFO™ Single-Component Epoxy Adhesive Underfill
This material is applied beneath flip chips, direct chip attachments, stacked die packages, and various ball grid array (BGA) components. After curing, underfill enhances the stability of these components, ensuring long-term performance.
Engineered for potting and encapsulating densely packaged electronic components.
Excellent bonding across a variety of substrates, from ferrite and ceramics to wood and metals.
Short thaw time and quick cold adhesion; once the compound flows from the container, it is ready to use.
Filled to yield a low coefficient of thermal expansion.
Fully machinable after curing; can be sanded, drilled, tapped, etc.
Wide application range in integrated circuits, semiconductors, thick film hybrid devices, relays, D/A converters, oscillators, amplifiers, power supplies, transformers, and more.
Underfill is essential in numerous packaging and board-level assemblies.
Suitable for Camalot® dispense machines, benefiting from SmartStream® pump technology, delivering fast and reliable underfill solutions for all types of packages.
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