TG-Frostbite - Non-silicone Thermal Compound
TG-Frostbite - Non-silicone Thermal Compound
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STIRRI®TG-Frostbite™ Non-silicone Thermal Compound
Used for mounting heat-generating assemblies to chassis (e.g., heat sink attachment to GPU/CPU/TPU), attachment of semiconductors, diodes, power transistors, ballast and thermal joints
Non-silicone - avoids common contamination and migration issues typical to silicone-based pastes and greases, great ROI
Top-shelf performance - long-term thermal stability without bleeding, drying, hardening, or melting
Aids in minimizing component stress on high altitudes. Suitable for demanding cooling applications in aerospace, defense, automotive, medical electronics systems.
No-drip, soft composition providing for low thermal resistance - highly efficient heat transfer
Easily spreads into a thin, homogenous film for high-speed OEM production without curing
Low evaporation index suitable for electrical vehicles and high-performance computing - data-center, AI, cryptocurrency computers, custom overclocked systems
Industrial wet-out performance
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Tecnología moderna de montaje en superficie para la era de los vehículos no tripulados y los viajes espaciales
Fabricado en los EE. UU. según los estándares industriales aplicables. ¡100% de satisfacción del cliente garantizada!