HT-525 - Sn5Pb92.5Ag2.5 high-temp leaded solder wire NC-core ROL0 - 100g spool

Size 0.15 mm / 0.005" 0.25 mm / 0.010" 0.4 mm / 0.015" 0.5 mm / 0.020" 0.7 mm / 0.025" 0.8 mm / 0.031" 1 mm / 0.040"

STIRRI®HT-525™ - Sn5Pb92.5Ag2.5 high-temp leaded solder wire NC-core ROL0 - 100g spool

High-Temperature Performance: Engineered for demanding applications, this core wire is ideal for semiconductors and multi-step assembly processes, ensuring reliable soldering under high thermal conditions.

Alloy Composition: Made of 5% Tin (Sn), 92.5% Lead (Pb), and 2.5% Silver (Ag), this alloy offers excellent mechanical strength and improved solder joint reliability.

Optimal Melting Point: With a melting point of approximately 296ºC and solidification temperature around 287ºC, this wire is perfect for controlled soldering environments and thermal cycling applications. (*LIQ and SOL temperature range as per IPC J-STD-006B)

No-Clean Flux Core: Features a rosin-based no-clean flux for superior wetting, minimal residue, and ease of use, ensuring clean and efficient soldering processes. Contains 2.5% rosin-based NC flux core

Certified Compliance: Meets IPC J-STD-006B standards for quality and performance, making it a preferred choice for high-temperature and semiconductor applications, conveniently packaged for practical use.